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François Dupont - Publications ORBI
Stoukatch, S., Dupont, F., & Kraft, M. (2018, November 19). Low-temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration. IEEE Xplore.
Peer reviewed
The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully ...
Stoukatch, S., Dupont, F., Seronveaux, L., Vandormael, D., & Kraft, M. (2018, February 01). Additive low temperature 3D printed electronic as enabling technology for IoT application. Electronics Packaging Technology Conference (EPTC).
Peer reviewed
There is no industrial method readily available to deposit a functional conductive metal pattern for electronic application on vertical sidewalls of thermal sensitive plastic materials. The most common methods ...
Bellier, P., Laurent, P., Stoukatch, S., Dupont, F., Joris, L., & Kraft, M. (2018). Autonomous micro-platform for multisensors with an advanced power management unit (PMU). Journal of Sensors and Sensor Systems, 7(1), 299-308.
Peer reviewed (verified by ORBi)
In this work, we developed and characterised an autonomous micro-platform including several types of sensors, an advanced power management unit (PMU) and radio frequency (RF) transmission capabilities ...
Laurent, P., Stoukatch, S., Dupont, F., & Kraft, M. (2018). Electrical characterization of Aerosol Jet Printing (AJP) deposited conductive silver tracks on organic materials. Microelectronic Engineering, 197, 67-75.
Peer reviewed (verified by ORBi)
This work investigates electrical properties of AJP (Aerosol Jet Printing) silver layers deposited at low temperature on variety of conventional and non-conventional for electronic application organic ...
Colson, G., Laurent, P., Bellier, P., Stoukatch, S., Dupont, F., & Kraft, M. (2017, May 10). Smart-shoes self-powered by walking. Poster session presented at Body sensor networks, Eindhoven, Pays-bas.
Peer reviewed
Nowadays, electronic devices are more and more compact and can be integrated in nearly every object. One of the remaining challenges is to provide smarter ways to power those electronic devices. Because of the ...
Laurent, P., Dupont, F., Stoukatch, S., & Axisa, F. (2015, March 11). Ultra-low power microsystems integrated. Conference proceedings.
Microsys has developed wireless microsystems using off-the-shelf components comprising ultra-low power sensors such as temperature, humidity and luminosity. We will show how to make the microsystem more ...